Jiaxing Ganland Auto Parts Co., Ltd's main products include trailer door lock system, Trailer Led Lights,door hinge system, door seal, door retainer, buckle, roller, e-track, winch, euphroe, buffer, folding step, lashing ring and other locks, hooks, latches, wrenches, aluminum sections and Container Corner Fittings etc
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Semi Trailer Door Parts,Trailer Door Latch,Steel Bar Door Locks,Trailer Led Lights Jiaxing Ganland Auto Parts Co., Ltd. , http://www.gltruckparts.com
It is difficult to have new technologies in the field of LED chips, and most of the new technologies in the application field are in design and intelligent systems. The transformation power of new technologies is not large, and the life cycle is quite short. However, as the middle link of the entire LED industry chain, its packaging The power of change in new technologies is enormous.
Packaging new technology has caused industry changes from single chip to multi-chip integration, to chip-on-board packaging (COB package), LED light source has undergone two changes.
A few years ago, a single chip package was the most widely used in packaging technology. 1W/piece or 0.5W/chip straw hat beads are the choice of most LED lamps, but in the past two years, with the popularity of patches, multi-chip Integrated packaging has become the most common form of packaging for high-power LED components. It can be divided into two types: small and medium power and high power chip integration components.
Looking at the chip-on-board package, COB packaging has become a new direction for package manufacturers and application companies. In the major LED lighting stores, the main use of COB light sources are LED downlights, LED spotlights, LED panel lights, etc. In the packaging manufacturers and application companies, the production scale of COB packaging products is not large, but because of the package form Most of them are mainly small-power chips, which increase the heat-conducting area and effectively improve the heat-dissipation defects. Therefore, in the past two years, they have become the new favorite of LED companies in the middle and lower reaches.
EMC and SMC packaging technologies have become the mainstream in the market. There are many packaging manufacturers in China. The production capacity is large and the quality is uneven. The well-known packaging manufacturers such as Jufei Optoelectronics, Ruifeng Optoelectronics, Guoxing Optoelectronics and other listed companies have a lot of market share. However, in the international arena, it is impossible to achieve a high reputation. The main reason is that there is no major breakthrough in the technology of the mainland packaging manufacturers, and the quality can not be superior.
At present, in the field of packaging, most of them are EMC packaging (epoxy film plastic packaging), SMC / SMD packaging (mostly in the form of patch) technology, in the market, especially in the LED indoor lighting market, the patch has become the most popular on the market. The light source, because the above two technologies can achieve large-scale production, reduce production costs, and design more flexible.
China's mainland market is dominated by small and medium power. In the field of LED indoor lighting, due to the low cost of medium and small power patches, mature technology and stable quality, small and medium power integrated components are the mainstream of the market, but there are also high-tech packaging companies. High-power patches, such as Shenzhen Haotian Optoelectronics.
No packaging technology changes the existing pattern of the industry At the major lighting exhibitions, the number of EMC packaging and SMC/SMD packaging products is the largest. Undoubtedly, EMC and SMC packaging will become the future trend of domestic LED packaging. But in the second half of last year, the industry emerged with a new package-free technology, namely ELC packaging technology. Taiwan Jingdian and the mainland's Xiamen Topstar Lighting have developed no-package technology, but this kind of package-free and non-drive technology has the same effect. In fact, ELC packaging technology is also a kind of package, just a brand new Advanced technology. However, the emergence of this technology will inevitably bring about profound changes in the existing pattern of LED packaging. 